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● 不同频率下稳定的介电性能

● 电子级玻璃纤维布增强无机陶瓷填料和碳氢类树脂复合介质材料

● 低的Z轴膨胀系数,优异的尺寸稳定性


● 高频无线通讯


● 微带和蜂窝基站天线

● 基站天线和功放

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Items Method Condition Unit Typical Value
Dielectric Constant,
Process Dk
IPC-TM-650 C-24/23/50, 10GHz - 3.30±0.05
Dielectric Constant, Dk IEC 61189-2-721 C-24/23/50, 10GHz - 3.45±0.05
Dissipation Factor, Df IPC-TM-650 C-24/23/50, 10GHz - 0.0025
IEC 61189-2-721 C-24/23/50, 10GHz - 0.0032
Thermal Coefficient of Dk IEC 61189-2-721
-40~150℃, 10GHz ppm/℃ +125
Volume Resistivity IPC-TM-650 A MΩ·cm 6.8 x 108
Surface Resistivity
A 5.3 x 107
Tg IPC-TM-650 2.4.25 DSC >280
Td IPC-TM-650 5% wt. loss >400
CTE (Z-axis) IPC-TM-650 2.4.24 30-260℃ ppm/℃ 55
CTE (X/Y-axis)
IPC-TM-650 2.4.41 30-260℃ ppm/℃ 13/15
Peel Strength IPC-TM-650 2.4.8 288℃/10s N/mm [lb/in] 1.0 [5.71]
Flexual Strength IPC-TM-650 2.4.4 A MPa 235
Water Absorption IPC-TM-650 D-24/23 % 0.1
Thermal Conductivity
ASTM D5470 100℃ W/(m·k) 0.69
Tensile Modulus (LW/CW) ASTM D638 A GPa
Tensile Strength (LW/CW) ASTM D638 A MPa 112/143


All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.

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